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Cooling Systems | Heat Sinks:

Thermal Silicone Pad

Thermal Silicone Pad

MP series

Thermal Silicone Pad (1.6~14.0 W/mk) ---------------------- In increase of heat transfer rate Soft and compressible Natural tack As buffer mate...

Thermal Tape

Thermal Tape

TP-05,TP-15,TP-20,TP-30

Thermal Tape (1.1~2.0 W/mk) --------------- In increase of heat transfer rate Easy to assemble Alternative for glue and screw Variety of thickn...

Non-Silicone Thermal Pad

Non-Silicone Thermal Pad

NS-20,NS-30,NS-50,NS-80

Non-Silicone Thermal Pad (2.0~8.0 W/mk) --------------- In increase of heat transfer rate Soft and compressible Natural tack As buffer material...

Temperature Uniformity EMI Shielding Material

Temperature Uniformity EMI Shielding Material

EM100B,EM100BT,EM100CU

Temperature Uniformity EMI Shielding Material (X-Y axis ,237 W/mk) Nano Carbon Copper Film (X-Y axis ,500 W/mk) --------------------- Temperature...

Thermal Putty

Thermal Putty

45G

Thermal Putty (4.5 W/mk) ------------- In increase of heat transfer rate. It can be infinitely compression. Low thermal resistance

Thermal Compound

Thermal Compound

GC-04,GC-04G,GC-07

Thermal Grease (4.1~7.0 W/mk) ---------------- In increase of heat transfer rate. Not easy dry and not harden. Maximize the heat transfer Very ...

Company: I.M TECHNOLOGY CO., LTD.

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